MT | Micron Technology | |
XXX | Product Family | 27C = OneNAND + LPDRAM MCP/PoP28C = NOR + LPDRAM MCP/PoP29C = NAND flash + LPDRAM MCP/PoP |
XX | NAND Flash Density | DM = 128MbitEM = 256MbitFM = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8GbitAG = 16GbitBG = 32GbitCG = 64GbitDG = 128Gbit |
XXX | LPDRAM Density | 56M = 256Mbit12M = 512Mbit40M = 640Mbit24M = 1Gbit52M = 1152Mbit48M = 2Gbit72M = 3Gbit96M = 4Gbit92M = 8Gbit |
X | Operating Voltage Range | A = 1.70V to 1.95VB = 1.65V to 1.90VC = 1.50V to 1.70VD = 1.20V to 1.50VF = 1.00V to 1.20VG = 1.70 – 1.95V DRAM; 2.70 – 3.60V NOR Vcc; 1.65 – 3.60V Vccq |
X | NAND Flash Configuration | A = x8, M28AB = x16, M28AC = x8, M48AD = x16, M48AE = x8, L58AF = x16, L58AG = x8, M49AH = x16, M49AJ = x8, M59AK = x16, M59AL = x8, L59AM = x16, L59AN = x8, M50AP = x16, M50AR = x8, L51AT = x16, L51AU = x8, M58AV = x16, M58AY = x8 M60AZ = x16, M60AAA = x8, M69AAB = x16, M69AAC = x8, M68AAD = x16, M68AAE = x8, M71MAF = x16, M71MAG = x8, M70MAH = x16, M70MAI = x8, M68MAJ = x8, M68MAL = x16, M61NAH = x16 QKHPAM = x16, M69NAK = x16, 3F0S |
X | LPDRAM Configuration | A = DDR, T37M x16B = SDR, Y37M x16C = DDR, T37M x32D = SDR, Y37M x32J = DDR, T48M x16K = SDR, Y48M x16L = DDR, T48M x32M = SDR, Y48M x32N = DDR, T47M x16P = SDR, Y47M x16R = DDR, T47M x32T = SDR, Y47M x32V = DDR, T67M x16Y = DDR, T67M x32Z = SDR, Y36N x16AA = DDR, T36N x16AB = DDR, T35M x32AC = SDR, Y35M x32AE = SDR, Y67M x16AF = SDR, Y67M, x32AG = SDR, Y67M x16 + Y35M x16AH = DDR, T68M x16AJ = SDR, Y68M x16AK = DDR, T68M x32AL = SDR, Y68M x32AM = DDR, T69M x16AN = SDR, Y69M x16AP = DDR, T69M x32AR = SDR, Y69M x32AS = SDR, Y47M x16(2) + Y35M x16AT = DDR, T48M x16(2) + T48M x32AU = DDR, T36N x32AV = DDR, T36N x32AY = DDR, T69M x32 + T68M x32AZ = DDR, T79M x16BA = DDR, T79M x32BB = DDR, T89M x32 |
X | Chip Count | A = 1 NAND, 1 LPDRAM (1xCE#, 1xCS#)B = 2 NAND, 1 LPDRAM (2xCE#, 1xCS#)C = 1 NAND, 2 LPDRAM (1xCE# 2xCS#)D = 2 NAND, 2 LPDRAM (2xCE#, 2xCS#)E = 1 NAND, 3 LPDRAM (1xCE#, 2xCS#)F = 2 NAND, 3 LPDRAM (1xCE#, 2xCS#)G = 1 NAND, 4 LPDRAM (1xCE#, 2xCS#)H = 1 NAND, 3 LPDRAM (1xCE#, 3xCS#) |
XX | Package Code | CA = 152-ball PoP VFBGA (14.0x14.0x0.9mm)CG = 152-ball PoP VFBGA (14.0x14.0x1.0mm)HC = 149-ball TFBGA (16.5x10.5x1.2mm)JA = 137-ball TFBGA (13.0x10.5x1.2mm)JC = 107-ball TFBGA (13.0x10.2x1.2mm)JG = 168-ball PoP VFBGA (12.0x12.0x0.9mm)JI = 168-ball PoP TFBGA (12.0x12.0x1.1mm)JQ = 152-ball PoP TFBGA (14.0x14.0x1.1mm)JR = 137-ball LFBGA (13x10.5x1.4mm)JS = 137-ball TFBGA (13x10.5x1.4mm)JV = 168-ball PoP VFBGA (12.0x12.0x1.0mm)KC = 107-ball TFBGA (13x10.5x1.1mm)KD = 137-ball TFBGA (13.0x10.5x1.1 mm)KN = 184-ball PoP VFBGA (14.0x14.0x1.0mm)KQ = 168-ball PoP WFBGA (12.0x12.0x0.75mm)KS = 137-ball VFBGA (13.0x10.5x1.0mm)MA = 168-ball PoP WFBGA (12.0x12.0x0.7mm)MC = 240-ball PoP WFBGA (14.0x14.0x0.8mm)MD = 130-ball VFBGA (9.0x8.0x1.0mm)ME = 240-ball PoP TFBGA (14.0x14.0x1.12mm)MF = 168-ball PoP VFBGA (12.0x12.0x0.85mm)MJ = 240-ball PoP VFBGA (14.0x14.0x0.85mm)MK = 153-ball VFBGA (12.0x10.0x0.9mm)ML = 153-ball VFBGA (9.0x8.0x0.9mm)MS = 191-ball PoP WFBGA (12.0x12.0x0.8mm)NE = 133-ball VFBGA (11.0x10.0x1.0mm)RN = 160-ball FBGA (11.5x11.5x0.94mm)TE = 153-ball VFBGA (12.0x10.0x1.0mm)PL = 162-ball WFBGA (13.0x11.5x0.8mm)SK = 162-ball VFBGA (13.0x11.5x0.9mm)SP = 192-ball WFBGA (10.5x8.0x0.8mm) |
X | LPDRAM Access Time | 5 = 200MHz, CL354 = 185MHz, CL36 = 166MHz, CL375 = 133MHz, CL38 = 125MHz, CL310 = 100MHz48 = 208MHz |
X | Special Options | Blank = StandardL = Low-power optionE = On-die ECC enabled |
XX | Operating Temperature Range | IT = Industrial (-40°C to 85°C)W = Wireless (-25°C to 85°C) |
XX | Production Status | Blank = ProductionES = Engineering sampleMS = Mechanical sampleQS = Qualification sampleDC = Daisy chain |